精密機械
Print ISSN : 0374-3543
36 巻, 425 号
選択された号の論文の9件中1~9を表示しています
  • Ga Asの化学研摩 (第2報)
    飯山 重幸, 井田 一郎, 古本 俊一
    1970 年 36 巻 425 号 p. 375-380
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    For finishing the junctions of GaAs diodes in ultra high frequencies and the substrata of their epitaxially grown layers with damage-free and mirror-like surfaces, the discal chemical polishing process is pursued from the the view-points of surface microstructure, roughness and damaged layer, including the process by dip-polishing. In addition, by growing the epitaxial layers on the surfaces, the surface qualities are compared with each other. The results obtained are as follows : (1) According to dip-polishing, the smoothness of surface is inferior to that by the discal polishing because of the formation of remains in dissolution. (2) By the discal polishing, the roughness is given as fine as 0.010.02 μ in Hmax, which is better in one order than that by dip polishing. (3) Under the estimation on chemically polished surfaces by electron diffraction, Kikuchi lines are exposed on the discally polished surfaces as well as on the surfaces by dipping. (4) The epitaxially grown surface whose substrate is polished by the method described here exhibits the better smoothness than that by dipping.
  • 岩田 一明, 佐藤 紘二
    1970 年 36 巻 425 号 p. 381-387
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    Theoretical equation on temperature distribution of workpiece in plasma arc cutting was analyzed. The experimental results measured by thermocouple method were compared with theoretical temperature calculated. The heat effects zone arised from plasma cutting was also investigated from the results of photomicrograph and microvickers hardness tester. These results were summarized as follows :
    (1) Theoretical temperature calculated showed a good agreement with the experimented one. Theoretical equation analyzed can be used to determine the effect of various factors on temperature distribution of workpiece in plasma cutting, providing the efficiency is assumed correctly.
    (2) Cutting temperatures of workpiece increased with an increase in heat input and a decrease in cutting speed. Regarding the effect of cutting gas on cutting temperature, cutting temperature of workpiece with nitrogen-oxygen mixture gas was lower than that with argon-hydrogen mixture gas. Also significant decrease of heat effects zone has been made by plasma cutting nitrogen-oxygen mixture gas torches.
    (3) As the results of the calculation on the heat input, it was found that the width of kerf was affected by the heat consumed for melting.
  • 柏原 稔, 服部 誠示
    1970 年 36 巻 425 号 p. 388-393
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    For establishing the bonding technology in the interconnections of semiconductor devices, the ultrasonic bonding mechanism is pursued from the viewpoints of plastic deformation on Al fine wires and the states of peeled surfaces after bonding with their relations to bonding strength, when bonding to Al-evaporated films and Au-plated surfaces. The results are as follows : (1) Plastic deformation of the wire is influenced by the material properties, the film thickness and the microscopic irregularities of the surfaces being bonded. (2) Its deformation characteristics are classified into slipping on bonded surfaces, adhesion and restriction on their interface and slipping of a tool tip on the bonded surface. The extent in deformation is different in each stages. (3) Bonding strangth is dependent on the adhesion between the metals on the interface, which is affected by the microscopic irregularities on the bonded surfaces as well as by the bonding factors. (4) Plastic deformation of the wire correlates with the behaviors of restriction on the bonded surfaces in the course of bonding. (5) The true metallic contact on the interface formed by plastic flow and the temperature rise due to friction contribute to the progress in the bonding process, while the metal diffusion makes the bonding accomplish.
  • 中村 喜十郎, 引地 恒夫, 柳沢 猛
    1970 年 36 巻 425 号 p. 394-402
    発行日: 1970/06/05
    公開日: 2010/05/07
    ジャーナル フリー
    Sound character of an idiophonic reed instrument is to be evaluated by the musical quality, the tone volume and their variation, and the time to start after touching the key. This paper asserts that their variation and the time are caused mainly by the variation of the reed tongue form when there is no irregularity of the clearance between a reed-tongue and a reed-hall, and shows (1) the tendencies of the changes of the characters of the musical sound of the reed, when the bending, twisting, or departing (from the reed plate) of the reed tongue is gradually changed, and (2) the idea, of mean curve and mean twisting angle distribution, and better mean curve and better mean twisting angle distribution for improved sound character.
  • 圧粉体の焼結に関する研究 (第1報)
    吉川 昌範, 西本 廉, 浅枝 敏夫
    1970 年 36 巻 425 号 p. 403-408
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    The purpose of this paper is to describe a systematic investigation of the change in length during sintering of compacts made of copper powders as a base material. Dimensional changes of compacts during sintering were measured with an automatic recording dilatometer.
    The results are as follows :
    (1) Small size electrolytic copper compacts under compacting pressures above 6 ton/cm2 shrink at the first step and then expand during sintering. This abnormal expansion is a result of the swelling of the surface layer of the sintered body which is caused by the existence of gas pockets enclosed in the compacts under the high compacting pressure. This swelling can be eliminated by adding a small amount of Mg and Ti to the compacts.
    (2) In the system copper-added metal, if the solid solution to copper is much the greater, copper-added metal compacts expand during sintering. On the other hand, if the solid solution to added metal is much the greater, or if the solid solution to copper and added metal each other is extremely small, the compacts shrink.
  • 普通鋳鉄について
    隈部 淳一郎, 福田 俊穂
    1970 年 36 巻 425 号 p. 409-415
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    According to literature, it has been very difficult to obtain surface roughness less than 2 in turning. The purpose of the present paper is to reduce above mentioned limit and to obtain better surface finish.
    The important results are as follows,
    1) Surface roughness of 0.5 μ is really possible by means of ultrasonic vibrating cutting (20 kHz in frequency, 16 μ in amplitude, 40 m/min in cuttingspeed, with carbide tool K 10) in turning gray cast iron (FC30).
    2) Theoretically estimated roughness almost coincides with experimental value even in the region of less than 1 μ.
  • 沖津 昭慶, 津和 秀夫
    1970 年 36 巻 425 号 p. 416-420
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    The structure and depth of the deformed layer produced on surfaces of annealed polycrystalline 65/35 α brass by scratching, grinding, wet lapping and indenting operation have been investigated by observing etch pit figures developed by high-sensitivity electrolytic thiosulphate etching.
    The following are the results that have so far been obtained.
    (1) The sharper the radius of the single point cutting tools, the more developed the zones of etch marking become, and the etch marking extends from 2 to 3 times as deep as the depth of the scratches.
    (2) Two distinct zones of deformation are produced beneath the scratch indentation. The first is a fragmented outermost layer; the second is a deformed zone in which slip-band etch markings of the face-centred cubic lattice are developed, and the severest slip-bands deformation occur on slip plane placed at right angles to the cutting direction.
    (3) Using an etch pit method it is able to reveal separately the repeated deformations which are produced by scrating at same point of the specimen.
    (4) The deformation which extends from the roots of the Vicker's indentation appear to be by slip mechanism.
  • 生産システムの研究 (第3報)
    岡村 健二郎, 山品 元
    1970 年 36 巻 425 号 p. 421-431
    発行日: 1970/06/05
    公開日: 2009/07/23
    ジャーナル フリー
    This paper deals with the problem of establishing a method for compound sequences. Compound sequences were considered by first constructing work element groups, and this approach was found to be advantageous from the point of view of being able to handle various technological restrictions and conditions otherwise difficult to formulate, to say nothing of precedence relations. It is also meritorious in that appreciable reduction in calculation times necessary for determining an optimum sequence was possible.
    From the viewpoint of the above method, elemental union was introduced for constructing a feasible work element group, and to prevent the overlapping of a set of these groups the combinatorial matrix approach was tried. A table of these sets was drawn up so as to simplify the preparation of compound sequences. Moreover consideration of the problem of the best arrangement for overlap type compound sequences resulted in the formulation of several effective results. Then compound product of work element groups was introduced for the establishment of compound sequences. This leads to easy, systematic and mechanical establishment of compound sequences.
  • 春田 博
    1970 年 36 巻 425 号 p. 432-442
    発行日: 1970/06/05
    公開日: 2010/01/20
    ジャーナル フリー
feedback
Top