Journal of The Japan Institute of Electronics Packaging

Volume 2, Issue 6

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Present and Future of Build-up PWB's

Their Possibility and Limitation

1999Volume 2Issue 6 Pages 425
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.425

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The Status and Future of Build-up PCB

Yutaka TSUKADA

1999Volume 2Issue 6 Pages 426-429
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.426

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Current Dielectric Material for Build-up Printed Wiring Board and Their Challenge

Toru TAKAHASHI

1999Volume 2Issue 6 Pages 430-435
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.430

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Film Type of Photosensitive Material for Build-up Process

Yoshikazu YAMAGAMI

1999Volume 2Issue 6 Pages 436-439
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.436

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Dielectric Materials for Build-up Printed Wiring Board

Tetsuro IRINO

1999Volume 2Issue 6 Pages 440-445
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.440

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Liquid Type Intermediate Dielectric Material for Build-up Process

Eiji TAKEHARA

1999Volume 2Issue 6 Pages 446-449
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.446

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Technology Trend of Build-up Printed Wiring Board

Yoshinori TAKAZAKI

1999Volume 2Issue 6 Pages 450-453
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.450

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Buried Bump Interconnection Technology Printed Circuit Board

Yoshizumi SATO, Yoshitaka FUKUOKA

1999Volume 2Issue 6 Pages 454-458
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.454

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Any Layer IVH Structure Multi-Layer Printed Wiring Board

Kazuaki SHIRAISHI

1999Volume 2Issue 6 Pages 459-462
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.459

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Design Method of Build-up PCB, Noise, Thermal and Impedance Matching Including Simulation

Yuji OHTSUBO

1999Volume 2Issue 6 Pages 463-467
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.463

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The Future Requirement of the Build-up PWB Structure & Its Circuit Design Environment

Koji IKAWA

1999Volume 2Issue 6 Pages 468-472
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.468

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Camcorder

Katsuya KOSUGA

1999Volume 2Issue 6 Pages 473-477
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.473

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Wareable Computer

Yutaka TSUKADA

1999Volume 2Issue 6 Pages 478-480
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.478

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Build-up Printed Wiring Board for Notebook PC

Akihiko HAPPOYA

1999Volume 2Issue 6 Pages 481-485
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.481

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MCM Mass-Production Technology by Flip Chip Mounting for Super Small Visual Radio

Hidenori KUWATA

1999Volume 2Issue 6 Pages 486-490
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.486

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Build-up PCB for Mobile Phone

Hisashi FUJISAKI, Yasunori TANAKA

1999Volume 2Issue 6 Pages 491-494
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.491

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Evaluation for Any Layer Inner Via Hole Structure Multilayer Printed Wiring Board for Cellular Mobile Telephones

Tomiyo EMA

1999Volume 2Issue 6 Pages 495-499
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.495

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Build-up Substrate Technology Use in Semiconductor Packages

Burton CARPENTER, Masahiro TSURIYA

1999Volume 2Issue 6 Pages 500-502
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.500

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Microvia Technology Trends: Product Boards and IC Packages

E. Jan VARDAMAN

1999Volume 2Issue 6 Pages 503-505
Published: October 01, 1999
Released on J-STAGE: March 18, 2010

DOIhttps://doi.org/10.5104/jiep.2.503

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