In this study diamond turning and Vickers indentation testing on single-crystal silicon, quartz crystal, fused silica, and glass were carried out. Based on the fracture behaviour of these brittle materials, the mechanism of ductile-regime turning was investigated. The material removal mechanism tends to change from ductile to brittle with increasing depth of cut. With the turning of single-crystal silicon, quartz crystal, and glass, cracks, produced by excessive tensile stress around thecutting edge of the tool, propagate upward from the cutting edge to the free surface of the work. However, since these cracks do not remain behind as damage on the turned surface, the turning process proceeds under a ductile regime. At a larger depth of cut, brittle fracture occurs due to elastic recovery (elastic/plastic mismatch stress field) after the cutting tool passes. This is the same mechanism as that found in crack formation occurring during the unloading period of the indentation cycle. On the other hand, the fused silica showed different fracture behaviour. After indentation, Hertzian cone crackswere produced at maximum tensile stress in the elastic stress field. Therefore, it is difficult to realise ductile-regime turning with fused silica, as extensive cracking is generated in front of the cutting edge.
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