These studies were performed on the formation of complex salts between cupric ion and oxyacids, and on the electroplating of copper in the solutions of these salts.
The order of descending stability of copper-aliphatic oxyacide was arranged in the descending order of solubility, as follows.
glycolate<lactate<malate<tartrate
The solubilities of cupric salicylate and sulfosalicylate were smaller, and lustrous deposit of copper could not be obtained in these solutions. Among copper-aliphatic oxyacids, adherent and lustrous deposit of copper on steel was obtained in the solution of malate or tartrate, above all. In general, concentration of free cupric ion for good deposit was 10
-4-10
-2g-ions/l and the optimum range of pH for the above purpose was 4.5-7.0, except for tartrate solution. Tartrate solution was the only one alkaline solution capable of giving lustrous deposit.
Throwing power was measured by using Haring cell on each solution of copper-oxyacid complex salts. The values expressed by the formula quoted from the British Standard Institution were nearly the equal in each salt, which lay between the equivalent values of acid sulfate solution and bright cyanide solution.
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