金属表面技術
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
17 巻, 4 号
選択された号の論文の6件中1~6を表示しています
  • 粉体の電気泳動電着 (第2報)
    長坂 秀雄
    1966 年 17 巻 4 号 p. 123-126
    発行日: 1966/04/20
    公開日: 2009/10/30
    ジャーナル フリー
    It was found that the best results were obtained by using the dispersion medium consisting of the mixed solution of nitro-methane and iso-propyl alcohol for the electrophoretic deposition of Al2O3 with zein as an activator. It would be discussed by the remarkable effects of the solubility curve of zein. The conditions of deposition were varied with the addition of water to the dispersion medium.
    It was observed that ζ-potential of Al2O3 particles was 80±10mV, which was supposed to be ζ-potential of zein itself.
  • 接点材料の研究 (第1報)
    久恒 中陽, 木全 秀視
    1966 年 17 巻 4 号 p. 127-132
    発行日: 1966/04/20
    公開日: 2009/10/30
    ジャーナル フリー
    Silver platings have been used as electrical contact by the development of electric power industry. This study was made on the effects of heat-treatment and thickness on the adhesion and contact resistance of silver platings.
    The following results were obtained.
    (1) Adhesive property of silver platings after bending test deteriorated by the heat-treatment at about 400°C.
    (2) Contact resistance of heat-treated thin silver platings (18μ, 53μ) at the load of 5kg was gradually reduced with the increase of circuit current up to 1amp., and then, decreased up to 10amp. On the other hand, contact resistance of thick silver platings (89μ, 117μ) was almost no changed with the increase of circuit current.
    (3) The relation between contact resistance and load was generally expressed by R=k·pm. The plating of the same thickness followed the above formula more accurately rather than those of the same heat-treatment. The value of m was determined on -0.119- -0.127 at the circuit current of 1amp.
  • 接点材料の研究 (第2報)
    久恒 中陽, 上田 俶完, 木全 秀視
    1966 年 17 巻 4 号 p. 133-138
    発行日: 1966/04/20
    公開日: 2009/10/30
    ジャーナル フリー
    Silver platings are frequently used as sliding contacts. Accordingly, hardness is one of the important factors pertaining to wear resistance. This study was made on the effects of heat-treatment and thickness on micro-hardness and wear resistance of silver platings.
    The following results were obtained.
    (1) The real micro-hardness of silver platings was gained at the thickness of over 85μ. It showed nearly Hv 80 in the plated state and was reduced to nearly Hv 38 after heat-treatment.
    (2) The wear resistance of silver platings was the highest in the plated state and was lower after heat-treatment.
    (3) The grain size of silver platings was nearly 3.9×10-5mm in the plated state and was gradually larger with heat-treatment.
  • 細川 邦典, 乾 忠孝
    1966 年 17 巻 4 号 p. 138-142
    発行日: 1966/04/20
    公開日: 2009/10/30
    ジャーナル フリー
    These studies were performed on the formation of complex salts between cupric ion and oxyacids, and on the electroplating of copper in the solutions of these salts.
    The order of descending stability of copper-aliphatic oxyacide was arranged in the descending order of solubility, as follows.
    glycolate<lactate<malate<tartrate
    The solubilities of cupric salicylate and sulfosalicylate were smaller, and lustrous deposit of copper could not be obtained in these solutions. Among copper-aliphatic oxyacids, adherent and lustrous deposit of copper on steel was obtained in the solution of malate or tartrate, above all. In general, concentration of free cupric ion for good deposit was 10-4-10-2g-ions/l and the optimum range of pH for the above purpose was 4.5-7.0, except for tartrate solution. Tartrate solution was the only one alkaline solution capable of giving lustrous deposit.
    Throwing power was measured by using Haring cell on each solution of copper-oxyacid complex salts. The values expressed by the formula quoted from the British Standard Institution were nearly the equal in each salt, which lay between the equivalent values of acid sulfate solution and bright cyanide solution.
  • 中山 孝廉
    1966 年 17 巻 4 号 p. 143-151
    発行日: 1966/04/20
    公開日: 2009/10/30
    ジャーナル フリー
  • 上田 益造
    1966 年 17 巻 4 号 p. 152-158
    発行日: 1966/04/20
    公開日: 2009/10/30
    ジャーナル フリー
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