金属表面技術
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
34 巻, 8 号
選択された号の論文の5件中1~5を表示しています
  • 松田 好晴
    1983 年 34 巻 8 号 p. 408-415
    発行日: 1983/08/01
    公開日: 2009/10/30
    ジャーナル フリー
  • 小見 崇, 山本 久
    1983 年 34 巻 8 号 p. 416-421
    発行日: 1983/08/01
    公開日: 2009/10/30
    ジャーナル フリー
    A trial has been conducted to bond 1μm α-silicon carbide particles firmly with the Watts nickel matrix of the coating, by annealing the coating at temperatures as low as possible and at a reasonable rate. Formation of a strong bonding was found on annealing the coating at 600°C. The bonding reaction, as detected and characterized by tensile testing, X-ray diffraction, scanning and transmission electron microscopy, was found to have an incubation period of two minutes and then proceeded to form a bonding layer, which was a composite; SiC/Ni5Si2/Ni3Si/graphite/Ni. On further annealing at 600°C, the dispersed particles transformed into Ni3Si particles coated with graphite film. The bonding erased the easy crack at the particle/matrix interface, generated a ductility of the coatings, and doubled the tensile strength of a coating at 400°C. The strengthening was described in terms of the Orowan mechanism, wherein a reaction-induced particle growth was considered. Some properties of the coatings were described on the basis of the dense random packing of the dispersed particles. A reaction was found at the SiC/Ni interface even on 500°C annealing, but with the incubation period of about five hours.
  • 福島 久哲, 秋山 徹也, 柿原 清貴, 安谷屋 武志, 東 敬
    1983 年 34 巻 8 号 p. 422-427
    発行日: 1983/08/01
    公開日: 2009/10/30
    ジャーナル フリー
    Zn-Fe-group metal binary alloys were electrodeposited from the sulfate baths containing 100g/m3 of inorganic impurities under galvanostatic conditions. The susceptibility of alloy composition to inorganic impurity in the Zn-Fe and Zn-Co systems was different from that in the Zn-Ni system. The content of Fe-group metals in the Zn-Fe and Zn-Co alloys was decreased by the addition of several kinds of inorganic impurities, while Zn-Ni alloy composition was scarcely affected. These effects of the impurities were discussed on the basis of the behavior of impurities during the anomalous codeposition of Zn with iron-group metals.
  • ラム チューラン, 小池 旭, 大野 湶, 春山 志郎
    1983 年 34 巻 8 号 p. 428-433
    発行日: 1983/08/01
    公開日: 2009/10/30
    ジャーナル フリー
    The morphology of pulse electrodeposited zinc from acidic zinc sulfate baths without the presence of additives has been studied by means of scanning electron microscopy and X-ray diffraction. The zinc deposit exhibited a bright smooth surface at an appropriate pulse condition. The current efficiency of this pulse plating increased beyond that of d-c plating with increasing the average current density at low duty cycles. The grain size of zinc deposit was also dependent on the average current density and pulse time. It decreases with increasing the average current density. At constant average current density and pulse width, the grain size decreased with decreasing the duty cycle. The reduction of grain size at appropriate pulse condition was explained in terms of an enhanced nucleation rate resulting from high overpotential attainable in pulse plating. The preferred orientation of the zinc deposit changed with increasing the average current density in the order [0001], [1120] and [1010], which is consistent with that of Pangarov's theory based on nucleation energetics.
  • 横井 昌幸, 小西 三郎
    1983 年 34 巻 8 号 p. 434-439
    発行日: 1983/08/01
    公開日: 2009/10/30
    ジャーナル フリー
    The roles of chloride ions and brightener-components in the bright copper plating were studied through observing the changes in Hull Cell patterns and cathodic polarization curves with the concentration of brightener-components for acid copper sulfate baths in the presence or absence of chloride ions. The brightener-components used were a polyoxyethylene-polyoxypropylene glycole (P), 2-Mercaptobenzothiazole-S-propanesulfonic acid (S) and a derivative of safronic dyes (J). Only in the presence of chloride ions bright copper plating was obtained under the addition of the three brightener-components in appropriate amounts. The brightener (P) and chloride ions were concluded to be the main components to obtain the bright copper plating and the others, (S) and (J), contributed to the brightening only in the presence of the main brightener components.
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