The role of magnesium sulfate used as a component of rhodium (III) sulfate plating solutions and of potassium selenate as an additive in rhodium deposition have been studied.
The deposition of rhodium from sulfate scid solution was followed by hydrogen evolution. High current density increased the grain growth of rhodium, random orientation being shown. On the addition of Mg
2+ as a solution component, the deposition potential of rhodium become noble, improving strain in the deposited layer, while the addition of Se
2+ made the deposition potential of rhodium less noble and resulted in finer graines with a similar tendency of orientation. It was found that the finer grains of the rhodium deposit resulted in a good surface. When both Mg
2+ and Se
2+ were contained, both adhesion and smoothness were even better.
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