近年, 電子機器の高性能化・小型化に伴い, 内蔵されている電子部品からの発熱が人きな問題となってきている。現状, プリント配線板においては, その熱対策として表面粗化したアルミニウム板をプリント配線板に絶縁樹脂を介して接着し, 放熱効率を向上させている。しかしながら, 従来の粗化処理法では0.4～1.0kNm^-1と接着強度が弱く, 熱処理などにおいてアルミニウムと樹脂間で剥離が生じ, 大きな問題となっている。そこで, 本研究ではアルミニウムと絶縁樹脂との接着性の向上を目的として, 新しい表面粗化方法の検討を行った。その結果, 本手法は従来法に比べて約10倍の接着強度を示し, 機械衝撃性などにも優れていることを確認した。

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In today's high-speed digital processing circuits meander lines, which intentionally zigzag to create a delay time, are used in order to match the timing between two or more signals. In the design of a delay line using a meander line, when the meander line is constructed with a shortened conductor in the parallel section of the hairpin, it is necessary to increase the number of meanders. In consequence, the number of corners is increased, which in turn shortens the delay time. On the other hand, when the delay line is constructed with a meander line with a small number of corners, it is necessary to make the conductor length in the hairpin parallel section longer. Increasing the length of the hairpin conductor causes increased coupling between the parallel conductors, which leads to a deterioration of the frequency characteristics of the phase-delay time. This paper reports the development of a microstrip meander line with a long parallel conductor section that is shielded by grounded conductors; the frequency characteristics of the phase-delay time were improved by the grounded conductors.

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The properties of bulk insulation in printed circuit boards (PCBs) have become even more important, especially for those with a multilayered or embedded structure. In particular, the spatial distribution of internal charge carriers, mainly due to ionic impurities, is thought to affect the reliability of bulk insulation. Therefore, the effects of humidity and temperature on space charge distribution profiles in a five-layered composite of aramid paper and epoxy resin are studied in this paper. More charge carriers are induced at higher temperatures with humidity. A relative humidity of 55% is high enough to induce a saturated amount of charge carriers in the present samples at 40°C.

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