近年, 急速な通信容量の増大化, 通信速度の高速化に伴った電気配線の限界から, チップ間/ボード間レベルの光インタコネクションが注目されている。光技術が有する高コスト, 低生産性の課題を解決するため, われわれは“光表面実装技術”および“光ピン”を軸とした研究を行っている。しかし従来の光ピンは, 容易に90度光路変換を実現する反面, 1対1の処理システムに限定され, 配線の自由度は低いものであった。そこで, 光ピンの先端を様々な形状に加工した多分岐型光ピンを提案する。多分岐型光ピンを用いることで, 光配線中に1対多分岐機能が付与されるため, 配線の自由度を高め, 並列処理システムが実現可能となる。本論文では, 主にV字カット型光ピンに着目し, 解析的および実験的検討を行ったので報告する。

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Acrylonitrile butadiene rubber (NBR) has been widely used in the electronics materials field because NBR has shown good compatibility with epoxy resins. However, it is not clear if the use of NBR for epoxy compounds is the best choice because the acrylonitrile units in NBR have poor electric properties. Taking both compatibility and electric properties into consideration, we have developed a new modified crosslinked styrene butadiene rubber (SBR) particle, which has a diameter of 70nm. This rubber showed a lower dielectric constant and a lower dissipation factor than NBR. Furthermore, these electric properties have been improved in the epoxy-phenol-SBR formulation. We found it possible to reduce the elastic modulus without sacrificing the electric properties.

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Acid copper plating has been extensively applied to various fields such as decorative plating and through-hole plating. In addition to these applications, this technology has been utilized for the metalization of small electronic devices since acid copper plating was adapted to the copper damascene process. Under such new trends, the proper assessment of additives, including their controllability and accessibility for a wide variety of demands, has become an urgent issue. Using commercially available acid copper plating processes, we have evaluated these factors for via-filling and for high throwing power. We compared them in terms of changes in the crystal size and grain of the deposited copper, which are known to change with time, and we also evaluated the influence of additives on the hardness and electrical resistivity. It was confirmed that optimization in selecting and quantifying additives enables deposition of a film characteristically comparable to the acid copper plating process with high throwing power even though the process has a special deposition capability like via-filling.

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The internal charge behaviour of insulation layers of printed circuit boards is discussed. Internal charges due to ion impurities can move under adc electric field, and the internal electric field is determined by the charges. The charge behaviour is strongly influenced by temperature and humidity. We have newly developed an in-situ space charge measurement system that can measure the space charge profiles in an environmental chamber at 85°C and 85%. Larger levels of internal charge were observed at higher humidity, and the electric fields near the electrodes were increased. The in-situ space charge measurement system should contribute to the study of ageing phenomena of insulation layers of PCBs.

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