Cold-rolled tough pitch copper and oxygen free copper were annealed for 1 hr at each of the following temperatures successively, namely, 20°, 100°, 158° (165°), 210°, 250°, 300° (308°), 367°, 443°, 518°, 600°, 700°C (temperatures in parentheses refer to oxygen free copper). Then the internal friction and its amplitude dependence were measured after each annealing at room temperature by the transversely vibrating bar method. The results were as following. (1) Before recrystallization, the internal friction was decreased with the annealing temperature and was independent of amplitude. (2) As recrystallization proceeded, a maximum developed in the internal friction-amplitude curve and the internal friction itself was much increased. These facts were inferred to be associated with birth of dislocations liberated from firm pins in the course of the recrystallization. (3) After annealing at higher temperatures than recrystallization completion temperature, both the internal friction and its amplitude dependence of oxygen-free copper were again decreased. This was looked upon as due to the concentration of impurities to the new-born dislocations.
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