Interdiffusion experiments of Cu-rich α Cu-Ni-Mn alloys have been performed in a temperature range from 1023 to 1133 K. The concentration profiles indicate that the diffusion distance of Mn is longer than that of Ni in these solid solutions. The interdiffusion fluxes evaluated from the equations of Dayananda and Kim show that the zero-flux planes exist in the diffusion zones of the Cu-Ni-Mn couples, The influence of the indirect fluxes becornes larger with the increase in Ni or Mn concentration. The diffusion paths show S-shaped curves. The direct coefficients \ ilde
DMnMnCu and \ ilde
DNiNiCu are positive, and the indirect coefficients \ ilde
DMnNiCu and \ ilde
DNiMnCu are negative. The four interdiffusion coefficients are very sensitive to the Ni and Mn concentrations, The temperature dependence of \ ilde
DMnMnCu, \ ilde
DMnNiCu, \ ilde
DNiNiCu and \ ilde
DNiMnCu at the concentration of Cu-16.2 at%Ni-15.2 at%Mn can be expressed by the following equations:
(This article is not displayable. Please see full text pdf.)
\
oindentThe frequency factor
D0 Mn(Cu-Ni)∗ and the activation energy
QMn(Cu-Ni)∗ for impurity diffusion of Mn in the Cu-Ni alloys are given by
(This article is not displayable. Please see full text pdf.)
\
oindentwhere
K0 and
K1 are constants,
Tm and
Tm Cu are the melting points of the Cu-Ni alloys or the pure Cu, respectively,
XNi is the atomic percentage of Ni, and
D0 Mn(Cu)∗ and
QMn(Cu)∗ are diffusion characteristics of Mn in Cu. From the estimated values of interaction parmeters, it is considered that the interaction energy of Ni-Mn bonds is much larger than those of the Cu-Ni and Cu-Mn bonds.
View full abstract