Thermal stresses of adhesively bonded multilayer plates were analyzed including the bending effects. In the present analysis, the bending displacements in each layer were assumed to be the same. This assumption simplified the thermal stress analysis in general multilayer plates.
Solutions obtained in the analysis were compared with other analytical and finite element solutions for 2-layer and 3-layer plates as examples. These results are shown as follows;
1. The present analysis is very simple to predict the shear stresses in adhesives and the normal stresses in members irrespectively of bending constraints.
2. When the bending is constrained, the shear stresses in adhesives and the normal stresses in members calculated by the present analysis agree with those by FEM. When the bending is free, the maximum shear stresses in adhesives arehigher than those by FEM and the maximum normal stresses in members agree with those by FEM.
The present analysis is useful in the design of adhesively bonded mult layer plates.
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