In order to investigate an optimum relation between temperature and duration at hot-pressing in the dry-process hardboard manufacturing system, experiments were designed, utilizing oak fiber mat containing 2% phenolic resin and 1.5% wax, hot-pressed under two-stage pressing diagram (Figs. 1, 2), in which the second stage hold pressures were elevated with higher temperatures.
Thermal decomposing reaction was found during the hot-pressing of mats (Fig. 5). Reaction was the first order one and the specific rate constant at each temperature could be calculated as Table 1 from the data of Fig. 6. Also activation energy could be found as 24.3kcal/mole, which was comparable with other investigators (Literature 11).
On the basis of manufacturing quality board economically, for example, having 400kg/cm
2 of modulus of rupture and 25% of water absorption without defects such as puncture, blown out or dark spot, following hyperbolic relation could be derived (Figs. 8, 9) :
t (T-162) =4900 (
z-1.7) where
t : Total hot-pressing duration in seconds.
T : Hot-platen temperature in °C.
z : Board thickness in mm.This shows that the presence of thermal decomposition is necessary on the dry-process hardboard manufacturing and satisfactory board would not be obtained, if mats were hot-pressed below 162°C. Also this equation cannot apply to thinner boards than 1.7mm. It is found empirically that, in case of thinner boards than 2.0mm, hot-pressing temperature must be lowered to avoid the occurrence of defects, compared with a thicker board manufacturing. This is based on the reason that thinner mats are easily compressed to higher densities under higher temperatures and longer pressing durations as employed in the thicker boards. Other reasons are press operational difficulties and press construction economics accompanied with rapid press cycle in the thinner boards.
Mat moisture is another important process variable which make board defective at pressing, because the compression of mats is accelerated with the presence of moisture. From the experience, punctures or dark spots would be often found over 1.2g/cm
3 of the board densities. Optimum correlation was found between mat moisture and pressing schedule, particularly for the first stage duration, and an equation could be derived as follows (Fig. 10) :
t1 (
m-3) =0.83 (279-
T) where
t1 : The first stage holding duration in seconds.
m : Fiber mat moisture content in %.
T : Hot-platen temperature in °C. From this equation, it would be found that temperatures higher than 279°C would be unnecessary for manufacturing satisfactory boards. The results of Fig. 812 would be useful for mill operation with lower fraction defective production of the dry-process hardboard.
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