This paper describes on a vision system for IC wafer street detection. The system uses a direct method for extracting the straight lines. The system differentiate the input image and extract straight lines which will correspond to both sides of the street of IC wafer. The straight line extraction is done not by a transform method but by a direct method. The system is implemented in a dicing machine. The features of the system are the gray level image processing, feature extraction, and learning functions.
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