Shinku
Online ISSN : 1880-9413
Print ISSN : 0559-8516
ISSN-L : 0559-8516
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Volume 18, Issue 5
Displaying 1-3 of 3 articles from this issue
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  • Purification, Analysis and Safety Handling of Gases
    Hikaru HARADA
    1975 Volume 18 Issue 5 Pages 155-161
    Published: May 20, 1975
    Released on J-STAGE: October 14, 2009
    DOIhttps://doi.org/10.3131/jvsj.18.155
    JOURNAL FREE ACCESS
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  • Evaporated InSb films obtained by controlling the substrate temperature
    Takaaki KATO
    1975 Volume 18 Issue 5 Pages 162-167
    Published: May 20, 1975
    Released on J-STAGE: October 14, 2009
    DOIhttps://doi.org/10.3131/jvsj.18.162
    JOURNAL FREE ACCESS
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    It has been studied that evaporated InSb thin films obtained by controlling the substrate temperature have high electron mobility. The method of controlling the substrate temperature is explained as follows : the source material of InSb is started to be fed on the source heater at the time when the substrate temperature starts to increase and is evaporated during about 30-40 seconds while the substrate temperature increases gradually. After the preprogrammed period of temperature increases, the substrate temperature becomes to decrease, but in this period the source material is not fed. The above process is repeated several times until the InSb film grows up 1.0-1.2 μm on the substrate. The InSb film thus prepared has an electron mobility of 30, 000 cm2/V·sec on the cleaved mica sheet and 20, 000 cm2/V·sec on the glass substrate measured at room temperature.
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  • Internal Stress in Evaporated Silver Films
    Hideki MITANI, Jiro FUKURA
    1975 Volume 18 Issue 5 Pages 168-173
    Published: May 20, 1975
    Released on J-STAGE: October 14, 2009
    DOIhttps://doi.org/10.3131/jvsj.18.168
    JOURNAL FREE ACCESS
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    Thin silver films have been prepared by vacuum deposition on acetyl-cellulose foils. Internal stresses in these films have been measured by sin2 φ method of X-ray stress measurement after removing the substrates in methyl acetate. It has been found that large tensile stresses remained in substrate free films.
    The stress is released as much as 1 × 109 dyn/cm2 in air within 20 hours. The tensile stress increases with thickness up to 1500Å and become constant, dependent on the deposition rate.
    The origin of the stress in the unbacked film is considered to be due to non uniformity of deformations in the film.
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