We have deposited silicon dioxide (SiO
2) film at temperatures lower than 300°C by supplying Hexamethyldisilazane (HMDS) and O
3 gas with nearly 100% concentration alternately and cyclically. The 100%-O
3 gas has confirmed to be reactive enough to decompose the HMDS gas into CO
2, H
2O as well as the precursors leading to SiO
2 deposition such as SiO even at room temperature. The physical characterization of thus deposited film gives a refractive index of 1.45-1.51, no Si-CH
3 bond content and a process-dependent Si-OH content in the film. The film deposited by 10 Pa-HMDS and 2700 Pa-100%-O
3 alternate supply has had a minimum Si-OH content and a good insulating property, i.e., leakage current density of lower than 10
-7 A/cm
2 at the electric field application of 4 MV/cm. This property is better than the film deposited by plasma-enhanced chemical-vapor-deposition using SiH
4/O
2 gas at 350°C.
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