Many alloy surfaces which have various composition are prepared by depositing palladium to a thickness of 11.7 nm onto (001) surface of copper and subsequent heatings. The surface structure of them is investigated by LEED and the mean surface composition of them is determined using AES data.
After depositing of palladium streak, c (2 × 2) and (1× 1) LEED patterns have been observed with decreasing palladium content. Surface periodicity of the c (2 × 2) structure is in agreement with that of a (001) section of the bulk ordered structure of Cu
3Pd (α').
Enrichment of copper or palladium in the surface of Cu-Pd alloy is shown to be small by analyzing the AES peaks at 60 eV, 770 eV and 840 eV for copper and at 330 eV for palladium.
View full abstract