In most experiments of RF sputter deposition of a-Si : H films, the depositing temperature is measured at the surface of the base plate (anode plate), but it exists great difference in temperature between the surface of depositing films and that of the electrode plate.
Especially, when KBr is used as the substrate material and pure H
2 is introduced as atmospheric gas, the difference increases, probably because of chemical reaction between KBr and H
2. This paper describes the detailed relationships between the temperature at the depositing surface and that of the base plate, with respect to the sputtering conditions.
It is concluded that the depositing temperature can not be represented by the substrate temperature.
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