Sputtering yields of Cu- and Au-films for bombardment by 40 keV Ar and O
2 ions have been measured using Ruterford backscattering of 180 keV He ions. In cases of both Ar ion on Cu-films and Ar and O
2 ions on Au-films, the dose dependence of sputtering yields is obtained in the range of about 100Å depth from the film surface, where sputtering yields are found to be nearly independent of these ion doses In the case of 02 ions on Cu-films, the sputtering yield decreases with the O
2 ion dose. This reduction is most likely caused by the formation of Cu
2O. The dependence of sputtering yields on incident angle is also obtained for Ar ions on Cu and for O
2 ions on Au. Results are compared with theoretical predictions.
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