市販の安価な材料を用いて，分光エリプソメーター用温度制御ステージの開発を行った。開発した温度制御ステージは，最大140℃程度まで基板を昇温可能で，加熱時も分光エリプソメーター本体に悪影響を及ぼさないことを確認した。温度制御ステージとステージ上の試料の温度差を補正するために，微細加工により作製した薄膜温度計を用いて温度校正を行った。この温度制御ステージを用いて，実際にPMMA が主成分である電子線レジスト薄膜の測定を行った。屈折率と膜厚の温度依存性の結果から，ガラス転位温度や屈折率の温度に対する変化量は，文献値と良い一致を示した。これらのことから，開発した温度制御ステージを用いて，分光エリプソメーターによる材料の温度依存性測定を精密に行うことが可能であることが示された。

The effect of water on the interactions between heat-treated aluminum and epoxy adhesive was experimentally investigated. The peel load of aluminum-epoxy bonded specimens was measured in a 180°peel test, with water dropping onto near the peeled edge during the test. At any heat treatment temperature condition, a decrease in load occurred immediately after exposure to water, resulting in interfacial separation. At the peeled edge, some hydrogen bonds are exposed, and are thought to be broken by contact with water, resulting in a decrease in peel load.

One of the challenges of adhesive bonding is long-term durability. The bonding strength can change over time due to exposure to environmental loads from water and oxygen in the surrounding environment and mechanical loads such as cyclic loading and creep loading, which can lead to unexpected fractures. When adhesion is used for bonding parts that require long-term durability, such as automobile bodies, appropriate durability assurance is necessary. For this purpose, it is important to clarify how and why the bond strength changes over time. This review focuses on the estimation method of the initial water diffusion, which triggers the ageing change due to water. Initial water diffusion into the adhesive layer leads to subsequent expansion, chemical changes and leaching. A proper estimation of the water diffusion is the first step towards clarifying why the bond strength changes over time and assuring the durability of the adhesive against water.